产品分类
SiC高温退火炉
所属分类：
立式炉管设备
半导体芯片设备
SiC高温退火炉
概要：
♦ 适用领域：化合物半导体 Relevant Industries: Compound Semiconductors ♦适用材料：SiC Suitable for Processing: Silicon Carbide (SiC) ♦晶圆尺寸：8/6英寸 Wafer Size: 8/6 inch ♦适用工艺：高温退火(Annealing) Applicable Processes: High-Temperature Annealing Applicable process: Annealing of SiC and GaN wafers
关键词：
SiC高温退火炉
SiC高温退火炉
产品应用/Product Applications
♦ 适用领域：化合物半导体 Relevant Industries: Compound Semiconductors
♦适用材料：SiC Suitable for Processing: Silicon Carbide (SiC)
♦晶圆尺寸：8/6英寸 Wafer Size: 8/6 inch
♦适用工艺：高温退火(Annealing) Applicable Processes: High-Temperature Annealing Applicable process: Annealing of SiC and GaN wafers
技术指标 Technical Parameters：
♦ 制程温度范围：800°C-1600°C Process Temperature Range: 800°C-1600°C
♦ 批次片数: 50片 Batch Capacity: 50 pcs
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