产品展示
♦ 适用领域：集成电路、先进封装、化合物半导体 Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors ♦ 适用材料: Si、SiC、GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) ♦ 晶圆尺寸：12/8 英寸 Wafer Size: 12/8 inch ♦ 适用工艺：氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、 合金(Alloy)、扩散(Diffusion) Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloy, Diffusion
适用领域：集成电路、先进封装 Relevant Industries: Integrated Circuits, Advanced Packaging 适用材料: Si Suitable for Processing: Silicon (Si) 晶圆尺寸：12/8 英寸 Wafer Size:12/8 inch 适用工艺：氮化硅(SiN)、多晶硅(Poly-Si/U-Poly/D-Poly)、 二氧化硅(TEOS)等 Applicable Processes: Silicon Nitride (SiN) Deposition, Polysilicon(Poly-Si / U-Poly /D-Poly) Deposition, Silicon Dioxide (TEOS) Deposition etc.