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♦适用领域：集成电路、先进封装 Relevant Industries: Integrated Circuits, Advanced Packaging ♦适用材料：Si、SiC Suitable for Processing: Silicon (Si), Silicon Carbide (SiC) ♦晶圆尺寸：12/8/6英寸 Wafer Size: 12/8/6 inch ♦适用工艺：氮化硅(SiN)、多晶硅(Poly-Si/U-Poly/D-Poly)、二氧化硅(TEOS)、HTO等 Applicable Processes: Silicon Nitride (SiN) Deposition, Polysilicon (Poly-Si / U-Poly / D-Poly) Deposition, Silicon Dioxide (TEOS) Deposition, HTO, etc.