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♦ 适用领域： 集成电路、先进封装 Relevant Industries: Integrated Circuits, Advanced Packaging ♦ 适用材料: Si、SiC Suitable for Processing: Silicon (Si), Silicon Carbide (SiC) ♦晶圆尺寸: 12/8/6英寸 Wafer Size: 12/8/6 inch ♦适用工艺: 氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、合金(Alloy)、扩散(Diffusion) Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloy, Diffusion