产品展示
♦ 适用领域： 集成电路、先进封装 Relevant Industries: Integrated Circuits, Advanced Packaging ♦ 适用材料: Si Suitable for Processing: Silicon (Si) ♦晶圆尺寸: 12/8英寸 Wafer Size: 12/8 inch ♦适用工艺: 氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、合金(Alloy)、扩散(Diffusion) Applicable Processes: Oxidation, Annealing, Polyimide Curing, Alloy, Diffusion