产品展示
产品分类
适用领域：集成电路、先进封装、化合物半导体 Relevant Industries: Integrated Circuits, Advanced Packaging, Compound Semiconductors 适用材料: Si、SiC、GaN Suitable for Processing: Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN) 晶圆尺寸：12/8/6英寸 Wafer Size: 8/6 inch 适用工艺：氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、 合金(Alloy)、扩散(Diffusion) Applicable Processes: High-Temperature Annealing