氧化/扩散设备
所属分类：
第一代半导体工艺设备
概要：
♦ 该设备是半导体生产线前工序的重要工艺设备之一，用于大规模集成电路、分立器件、电力电子、光电器件等行业的扩散、氧化、退火、合金和烧结等工艺 ♦ 设计了硅片生产的多种工艺性能需要，具有生长效率高、产品性能优越的特点 ♦ 具有污染低、占地面积小、温度均匀、可装载晶圆尺寸大、工艺稳定性高等优点 ♦ 主要用于初始氧化层、屏蔽氧化层、衬垫氧化层、牺牲氧化层、场氧化层等多种氧化介质层的制备工艺
关键词：
氧化/扩散
氧化/扩散设备
产品概述/Product Introduction：
♦ 该设备是半导体生产线前工序的重要工艺设备之一，用于大规模集成电路、分立器件、电力电子、光电器件等行业的扩散、氧化、退火、合金和烧结等工艺
This equipment is one of the important process equipments in the front process of semiconductor production line, which is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices.
♦ 设计了硅片生产的多种工艺性能需要，具有生长效率高、产品性能优越的特点
The design takes into account various process performance requirements of silicon wafer production, and has the characteristics of high growth efficiency and superior product performance.
♦ 具有污染低、占地面积小、温度均匀、可装载晶圆尺寸大、工艺稳定性高等优点
It has the advantages oflow pollution, small occupied area, uniform temperature, large wafer size and high process stabili-
♦ 主要用于初始氧化层、屏蔽氧化层、衬垫氧化层、牺牲氧化层、场氧化层等多种氧化介质层的制备工艺
Mainly used in the preparation process of various oxidation dielectric layers such as initial oxide layer, shielding oxide layer, gasket oxide layer, sacrificial oxide layer and field oxide layer.
产品特点/Product characteristics：
♦ 高洁净度:包括材料、工艺环境等
High cleanliness: including materials, process environment, etc.
♦ 高精度:包括炉内温度、进流量、排气压力、运动控制等
High precision: including furmace temperature, inlet flow, exhaust pressure, motion control, etc
♦ 高安全性:包括气体泄漏检测、气流检测、人机互锁等
High safety: including gas leakage detection, airflow detection, man- machine interlocking, etc
技术指标/Technical Indicators：
|
晶片类型: 6/8/12英寸晶圆 Wafer type: 6/8/12 inch wafer |
工作温度范围: 800°C-1250°C Operating temperature range: 800°C-1250°C |
|
恒温区长度:≥860mm Length of constant temperature zone:≥860mm |
可根据客户要求定制产品 Customized products can be made according to customer requirements |
应用范围/Scope：
♦ 广泛用于半导体材料的氧化处理，也可用于推阱、退火、合金、掺杂等工艺
It is widely used in oxidation treatment of semiconductor materials, and can also be used in well pushing, annealing, alloying, doping and other processes.
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