真空退火设备

所属分类：

第一代半导体工艺设备

概要：

◆ 主要用于半导体器件退火及烧结等工艺，可进行真空、气体保护等 ◆ 设备结构新颖,操作方便 ◆ 在一台设备上可以完成多个工艺流程

关键词：

真空退火

真空退火设备

产品概述/Product Introduction：

♦ 主要用于半导体器件退火及烧结等工艺，可进行真空、气体保护等

Mainly used for annealing and sintering of semiconductor devices, and can be protected by vacuum and gas

♦ 设备结构新颖，操作方便

The equipment has novel structure and convenient operation

♦ 在一台设备上可以完成多个工艺流程

Multiple process flows can be completed on one equipment

产品特点/Product Characteristics：

♦ 自动化程度高

High degree of automation

♦ 采用进口温度控制器，温控器能受控运行、停止、保持，灵活控制工艺温度变化

Adopting imported temperature controller, the temperature controllercan be controlled to run, stop andmaintain, and flexibly control the process temperature change

♦ 电气元器件采用进口知名品牌元器件，保证了设备具有较好的稳定性、可靠性

The electrical components are imported well-known brand components, which ensures good stability andreliability of the equipment

♦ 处理全过程由工业计算机智能化自动控制化能够实现全程监控、跟踪、自诊断功能、模拟显示设备的工作状态，升温和降温速度可控

The whole processing process is controlled by industrial computer intelligently and automatically, which canrealize the functions of whole process monitoring,tracking and self-diagnosis, simulate and display the workingstate of equipment, and control the heating and cooling speed

技术指标/Technical Indicators：

最高温度:200-800℃

Maximum temperature: 200-800℃

恒温区:1200mm(长度可定制)

Constant temperature zone: 1200mm (length can be customized)

控温精度:±1℃

Temperature control accuracy: ± 1℃

真空室:2-3工位

Vacuum chamber: 2-3 stations

真空度:≤5*10^-4*pa

Vacuum degree:≤5*10^-4*pa

升温速率:15℃/min