山东力冠升级PVT设备，引领8-12英寸碳化硅晶圆高效量产

2025-07-30

为突破大尺寸碳化硅（SiC）晶圆在生长效率、均匀性控制及成本方面的关键瓶颈，山东力冠微电子装备有限公司近日正式发布其12英寸PVT电阻设备及8英寸多坩埚设备。为8-12英寸SiC晶圆的规模化、稳定化、低成本制备树立了新的行业标杆。

设备升级亮点聚焦

12英寸PVT电阻炉：直指规模化量产痛点

产能跃升：单炉次生长效率提升达40%，显著加速12英寸SiC晶圆的产业化落地步伐。

均匀性保障：集成先进多温区精准控制技术，有效确保晶格质量与厚度一致性，满足严苛的量产质量要求。

山东力冠12英寸PVT电阻炉

8英寸多坩埚方案：降本提效的关键引擎
效率倍增，成本锐减：

采用3-5个坩埚同步生长，单次产出能力成倍提升，大幅摊薄晶锭的制造成本。

智能精准控制：创新的硬件架构与自主研发的智能控制软件深度融合，实现高精度温度与真空压力动态调控。

突破热场均匀性：独家多坩埚协同温场技术，系统性解决传统超大尺寸设备长期存在的热场分布不均问题。

保障工艺稳定性：高度自动化控制系统最大限度减少人为干预，确保生产过程的高良率与批次一致性。

市场拓展与创新驱动

山东力冠微电子装备凭借其深厚的技术积淀和快速响应的市场策略，已与国内多家头部半导体企业建立起深度合作关系，并正积极拓展全球市场，国际影响力稳步提升。

展望未来，山东力冠微电子装备将持续聚焦大尺寸、高性价比PVT设备的研发与迭代，致力于通过核心设备的技术突破，提升全球SiC产业链的效率与韧性，促进供应链多元化发展，为半导体材料的革新与广泛应用持续提供关键动能。

Shandong Liguan Microelectronics Equipment Co., Ltd. Upgrades PVT Equipment, Pioneering High-Efficiency Mass Production of 8-12-Inch SiC Wafers

To address the key bottlenecks in the growth efficiency, uniformity control, and cost of large-size silicon carbide (SiC) wafers, Shandong Liguan Microelectronics Equipment Co., Ltd. has officially launched its 12-inch PVT resistance equipment and 8-inch multi-crucible equipment. This breakthrough sets a new industry benchmark for the large-scale, stable, and low-cost production of 8-12 inch SiC wafers.

Highlights of Equipment Upgrades

12-inch PVT Resistance Furnace: Targeting Mass Production Challenges

Capacity Leap: Single-run growth efficiency increased by 40%, significantly accelerating the industrialization of 12-inch SiC wafers.

Uniformity Assurance: Equipped with advanced multi-zone precision temperature control, ensuring consistent lattice quality and thickness to meet stringent mass production standards.

Shandong Liguan Microelectronics Equipment Co., Ltd. 12-inch PVT Resistance Furnace

8-Inch Multi-Crucible Solution: The Key Engine for Cost Reduction and Efficiency Improvement

Efficiency Doubled, Costs Sharply Reduced:
By utilizing 3-5 crucibles for simultaneous crystal growth, single-run production capacity is multiplied, significantly reducing the manufacturing cost per wafer.

Intelligent Precision Control:
Innovative hardware architecture combined with proprietary intelligent control software enables high-precision dynamic regulation of temperature and vacuum pressure.

Breakthrough in Thermal Field Uniformity:
Exclusive multi-crucible cooperative thermal field technology systematically addresses the long-standing issue of uneven heat distribution in traditional large-scale equipment.

Ensuring Process Stability:
A highly automated control system minimizes human intervention, guaranteeing high yield rates and batch-to-batch consistency.

Market Expansion and Innovation-Driven Growth

Shandong Liguan Microelectronics Equipment Co., Ltd. leveraging its profound technological expertise and agile market strategy, has established deep partnerships with multiple leading domestic semiconductor enterprises. The company is now actively expanding its global footprint, with steadily growing international influence.

Looking ahead, Shandong Liguan Microelectronics Equipment Co., Ltd. will remain committed to the R&D and iteration of large-scale, cost-effective PVT equipment. By driving breakthroughs in core technologies, the company aims to enhance the efficiency and resilience of the global SiC supply chain, promote supply chain diversification, and provide critical momentum for the innovation and widespread adoption of semiconductor materials.