力冠突破｜山东力冠12英寸炉管设备赋能半导体产业升级

12英寸全系列设备重磅亮相
 

经过十三年来的技术沉淀与创新突破，山东力冠精准把握行业发展趋势，经过1000多个日夜持续的技术攻坚，10000多个小时的测试验证，最终攻克大尺寸设备核心技术瓶颈，全面覆盖集成电路、先进封装等核心应用领域，适配多种材料，可满足多样化工艺需求。

· 12英寸氧化/合金/退火设备：

适用于氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、合金(Alloy)等工艺。

· 12英寸LPCVD设备：

适用于氮化硅(SiN)、多晶硅(Poly-Si/U-Poly/D-Poly)、二氧化硅(TEOS)、HTO等工艺。

· 12英寸ALD设备：

适用于氮化硅(SiN)、二氧化硅(SiO2)等膜层的沉积。

作为山东省“专精特新中小企业”“瞪羚企业”，山东力冠凭借扎实的技术积累，已斩获多项行业荣誉，产品不仅覆盖国内市场，更出口中国台湾、新加坡、欧美等国家，获得全球客户的认可。

未来，山东力冠将持续深耕半导体装备领域，不断推进技术迭代与产品升级，在巩固12英寸炉管设备全覆盖优势的基础上，积极向更高工艺制程、更先进半导体装备研发进军，助力中国半导体产业突破瓶颈、实现高质量发展，朝着成为世界级半导体行业领导者的目标不断迈进。

Liguan Breakthrough: Shandong liguan Empowers Semiconductor Upgrade, Conquering the Large-Size Equipment Peak.

Shandong Liguan Embarks on a New Journey! Recently, Shandong Liguan Microelectronic Equipment Co., Ltd. has successfully expanded into the 12-inch semiconductor core equipment sector, launching a full series of 12-inch equipment for Oxidation/Alloy/Annealing/LPCVD/ALD processes. 

Since its inception in 2013, the company began with 4-inch vertical furnace systems and has steadily advanced, achieving independent R&D and iterative upgrades for 6-inch and 8-inch tools. Now, with full-series coverage of 12-inch vertical furnace equipment, Shandong Liguan has established itself as a key player in the domestic large-wafer semiconductor equipment landscape, providing robust support for China's pursuit of self-sufficiency and control over its semiconductor supply chain.

Focusing on the Core Track: 12-Inch Full-Series Equipment Makes a Grand Debut
After 13 years of technological accumulation and innovation breakthroughs, Shandong Liguan has precisely grasped industry development trends. Through over 1,000 days and nights of continuous technical and more than 10,000 hours of testing and validation, the company has finally overcome the core technical bottlenecks of large-size equipment. Its products now comprehensively cover core application areas such as integrated circuits and advanced packaging, are compatible with various materials, and can meet diverse process requirements.

Highlights of Core Equipment

• 12-Inch Oxidation/Alloy/Annealing Equipment: Suitable for processes such as Oxidation, Annealing, Polyimide curing, and Alloy.

• 12-Inch LPCVD Equipment: Suitable for processes involving Silicon Nitride (SiN), Polysilicon (Poly-Si/U-Poly/D-Poly), Silicon Dioxide (TEOS), HTO, etc.

• 12-Inch ALD Equipment: Suitable for depositing film layers such as Silicon Nitride (SiN) and Silicon Dioxide (SiO2).